From Advanced Metal Etching
The photochemical etching technical data table below highlights our machining capabilities and lowest tolerances. These variations depend on a parts’ dimensions and the metal thickness. We will work with you to achieve the lowest possible tolerance and the highest number of parts per sheet.
|Table 1 Etched Dimension Tolerances|
|Thickness (T) in inches|
|Table 2 Holes or Slots|
|Metal Thickness (T)||Diameter or Width|
|.001″ -0.005″||At least Metal Thickness, Minimum .003″|
|.005″ or Over||Minimum of 1.1 times
|Table 3 Web or Finger|
|Thickness (T)||Space Between Holes (W)|
|Less than .005″||At least Metal Thickness, Minimum .003″|
|Over .005″||Minimum of 1.0 times
|Table 4 Center to Center Tolerances|
|C/C Dimensions (inches)||Tolerance Attainable|
|1.0″ or Less||±.0005″|
|1.0″ – 3.0″||±.0010″|
|3.0″ – 6.0″||±.0020″|
|6.0″ – 10.0″||±.0030″|
|Table 5 Half Etch Based on Material Thickness|
|25% – 75%||100% +||25%|
Photochemical Etching is also called metal etching, chemical etching, chemical milling, photo etching, chemical etching, photochemical machining, chemical machining.
Photo etching is a process used in the creation of integrated circuits, which combines photolithography with the etching process. Photolithography is used to form patterns on semiconductor substrates coated with photoresist, resulting in selective developing of the photoresist, when exposed to ultra-violet light through a photomask. The substrate is then etched, during which process the developed photoresist serves as a barrier against the etchant, resulting in only the selected area being etched.