Data Sheet

Typical Photoetching Dimensions for Metal Specialties and Complex Metal Parts from Advanced Metal Etching

Photo etching dimensions for metal specialties and complex metal parts.
Table 1    Etched Dimension Tolerances
Thickness (T) in inches
.001"
.002"
.005"
.010"
.015"
.020"
.040"
Empirical
±.0010
±.0010
±.0015
±.0020
±.0030
±.0050
Table 2    Holes or Slots
Metal Thickness (T)
Diameter or Width
.001" -0.005"
At least Metal Thickness, Minimum .003"
.005" or Over
Minimum of 1.1 times
Metal Thickness
Table 3    Web or Finger
Thickness (T)
Space Between Holes (W)
Less than .005"
At least Metal Thickness, Minimum .003"
Over .005"
Minimum of 1.0 times
Metal Thickness
Table 4    Center to Center Tolerances
C/C Dimensions (inches)
Tolerance Attainable
1.0" or Less
±.0005"
1.0" - 3.0"
±.0010"
3.0" - 6.0"
±.0020"
6.0" - 10.0"
±.0030"
Table 5    Half Etch Based on Material Thickness
A
B
C
25% - 75%
100% +
25%

What is Photo Etching?

Photo Etching is also called metal etching, chemical etching, chemical milling, photo etching, chemical etching, photochemical machining, chemical machining.

Photo etching is a process used in the creation of integrated circuits, that combines photolithography with the etching process. Photolithography is used to form patterns on semiconductor substrates coated with photoresist, resulting in selective developing of the photo-resist, when exposed to ultra-violet light through a photomask. The substrate is then etched, during which process the developed photoresist serves as a barrier against the etchant, resulting in only the selected area being etched.