Photochemical Etching Technical Data Capabilities
From Advanced Metal Etching

The photochemical etching technical data capabilities table below highlights our chemical etching machining capabilities and lowest tolerances. These variations depend on a parts’ dimensions and the metal thickness.  We will work with you to achieve the lowest possible tolerance and the highest number of parts per sheet.

Table 1    Etched Dimension Tolerances
Thickness (T) in inches
.001″ .002″ .005″ .010″ .015″ .020″ .040″
Empirical ±.0010 ±.0010 ±.0015 ±.0020 ±.0030 ±.0050
Table 2    Holes or Slots
Metal Thickness (T) Diameter or Width
.001″ -0.005″ At least Metal Thickness, Minimum .003″
.005″ or Over Minimum of 1.1 times
Metal Thickness
Table 3    Web or Finger
Thickness (T) Space Between Holes (W)
Less than .005″ At least Metal Thickness, Minimum .003″
Over .005″ Minimum of 1.0 times
Metal Thickness
Table 4    Center to Center Tolerances
C/C Dimensions (inches) Tolerance Attainable
1.0″ or Less ±.0005″
1.0″ – 3.0″ ±.0010″
3.0″ – 6.0″ ±.0020″
6.0″ – 10.0″ ±.0030″
Table 5    Half Etch Based on Material Thickness
25% – 75% 100% + 25%

What is Photochemical Etching?

Photochemical Etching is also called metal etching, chemical etching, chemical milling, photo etching, chemical etching, photochemical machining, chemical machining.

Photo etching is a process used in the creation of integrated circuits, which combines photolithography with the etching process. Photolithography is used to form patterns on semiconductor substrates coated with photoresist, resulting in selective developing of the photoresist, when exposed to ultra-violet light through a photomask. The substrate is then etched, during which process the developed photoresist serves as a barrier against the etchant, resulting in only the selected area being etched.

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